1. Through-vias
Assembly holes, component pin holes and through-via penetrate all layers of a multilayer PCB. The diameter of THT holes bigger than 0.5mm are normally increased due to the plating thickness of about 0.1mm. VIAs with diameter smaller than 0.5 mm are typically not enlarged - their size depends on the size of drill pad and the restring, unless otherwise indicated.
The smallest holes determines the drilling depth ( T - B )
| Hole diameter (mm) | 0,15 | 0,20 | 0,25 | 0,30 | 0,35 | 0,40 | 0,50 |
| Maximum depth (mm) | 0,8 | 1,5 | 1,8 | 2,2 | 2,6 | 3,2 | 5,0 |
2. Blind vias
Blind vias have always contact to an outer layer and to one or several inner layers
The smallest holes determines the drilling depth ( T - I... ) or ( B - I...
| Hole diameter (mm) | 0,15 | 0,25 | 0,30 | 0,35 | 0,40 |
| Maximum depth (mm) | 0,15 | 0,25 | 0,30 | 0,30 | 0,35 |
3. Buried vias
Buried vias connect two or more innerlayers and never have any contact to an outer layer
The smallest holes determines the drilling depth ( I... - I... )
| Hole diameter (mm) | 0,15 | 0,20 | 0,25 | 0,30 | 0,35 | 0,40 | 0,50 |
| Maximum depth (mm) | 0,8 | 1,5 | 1,8 | 2,2 | 2,6 | 3,2 | 5,0 |
4. Plated or Non-plated slots
| Special plating holes and slots performed directly on routing machine through slot drill diameter 0.6 to 2.4 mm or milling. For plating cutouts use a separate gerber layer showing borderline shaped cutout thin line or directly milling file. The middle line indicates the slot size. Data can also enter through the drilling of the file where you specify a separate "T" tool edge position of the groove. Technology plated cutouts highlight please your order.
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5. Plated half holes
| Only holes larger than 0.5mm can be made as half-holes on the edge. Each plated hole on the edge of the PCB must have its own pad on the TOP and BOTTOM !!! |
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